Electronic device and manufacturing thereof

ABSTRACT

An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.

BACKGROUND

This invention relates to an electronic device and a method ofmanufacturing thereof.

Power semiconductor chips may, for example, be integrated intoelectronic devices. Power semiconductor chips are suitable, in oneembodiment, for the switching or control of currents and/or voltages.Power semiconductor chips may, for example, be implemented as powerMOSFETs, IGBTs, JFETs or power bipolar transistors.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of embodiments and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments andtogether with the description serve to explain principles ofembodiments. Other embodiments and many of the intended advantages ofembodiments will be readily appreciated as they become better understoodby reference to the following detailed description. The elements of thedrawings are not necessarily to scale relative to each other. Likereference numerals designate corresponding similar parts.

FIG. 1 schematically illustrates a device 100 as an exemplaryembodiment.

FIG. 2 schematically illustrates a device 200 as a further exemplaryembodiment.

FIG. 3 schematically illustrates a device 300 as a further exemplaryembodiment.

FIG. 4 schematically illustrates a device 400 as a further exemplaryembodiment.

FIGS. 5A to 5F schematically illustrate an exemplary embodiment of amethod to fabricate a device 500.

FIG. 6 schematically illustrates a device 600 as a further exemplaryembodiment.

FIG. 7 schematically illustrates a device 700 as a further exemplaryembodiment.

FIG. 8 schematically illustrates a device 800 as a further exemplaryembodiment.

FIG. 9 schematically illustrates a device 900 as a further exemplaryembodiment.

DETAILED DESCRIPTION

In the following Detailed Description, reference is made to theaccompanying drawings, which form a part hereof, and in which is shownby way of illustration specific embodiments in which the invention maybe practiced. In this regard, directional terminology, such as “top,”“bottom,” “front,” “back,” “leading,” “trailing,” etc., is used withreference to the orientation of the Figure(s) being described. Becausecomponents of embodiments can be positioned in a number of differentorientations, the directional terminology is used for purposes ofillustration and is in no way limiting. It is to be understood thatother embodiments may be utilized and structural or logical changes maybe made without departing from the scope of the present invention. Thefollowing detailed description, therefore, is not to be taken in alimiting sense, and the scope of the present invention is defined by theappended claims.

It is to be understood that the features of the various exemplaryembodiments described herein may be combined with each other, unlessspecifically noted otherwise.

Devices with semiconductor chips are described below. The semiconductorchips may be of extremely different types and may include for exampleintegrated electrical or electro-optical circuits. The semiconductorchips may, for example, be configured as power semiconductor chips, suchas power MOSFETs (Metal Oxide Semiconductor Field Effect Transistors),IGBTs (Insulated Gate Bipolar Transistors), JFETs (Junction Gate FieldEffect Transistors) or power bipolar transistors. Furthermore, thesemiconductor chips may include control circuits, microprocessors ormicroelectromechanical components. In one embodiment, semiconductorchips having a vertical structure may be involved, that is to say thatthe semiconductor chips may be fabricated in such a way that electriccurrents can flow in a direction perpendicular to the main surfaces ofthe semiconductor chips. A semiconductor chip having a verticalstructure may have contact elements in one embodiment on its two mainsurfaces, that is to say on its top side and bottom side. In oneembodiment, power semiconductor chips may have a vertical structure. Byway of example, the source electrode and gate electrode of a powerMOSFET may be situated on one main surface, while the drain electrode ofthe power MOSFET is arranged on the other main surface. Furthermore, thedevices described below may include integrated circuits to control theintegrated circuits of other semiconductor chips, for example theintegrated circuits of power semiconductor chips. The semiconductorchips need not be manufactured from specific semiconductor material, forexample Si, SiC, SiGe, GaAs, and, furthermore, may contain inorganicand/or organic materials that are not semiconductors, such as forexample insulators, plastics or metals. Moreover, the semiconductorchips may be packaged or unpackaged.

The semiconductor chips have electrodes (or contact pads) which allowelectrical contact to be made with the integrated circuits included inthe semiconductor chips. One or more metal layers may be applied to theelectrodes of the semiconductor chips. The metal layers may bemanufactured with any desired geometric shape and any desired materialcomposition. The metal layers may, for example, be in the form of alayer covering an area. Any desired metal or metal alloy, for examplealuminum, titanium, gold, silver, copper, palladium, platinum, nickel,chromium or nickel vanadium, may be used as the material. The metallayers need not be homogenous or manufactured from just one material,that is to say various compositions and concentrations of the materialscontained in the metal layers are possible.

The semiconductor chips may be mounted on carriers. The carrier may beof any shape, size or material. During the fabrication of the devicesthe carrier may be provided in a way that other carriers are arranged inthe vicinity and are connected by connection means to the carrier withthe purpose of separating the carriers. The carrier may be fabricatedfrom metals or metal alloys, in one embodiment copper, copper alloys,iron nickel, aluminum, aluminum alloys, or other materials. It mayfurther be electrically conductive. Furthermore, the carrier may beplated with an electrically conductive material, for example copper,silver, iron nickel or nickel phosphorus. The carrier may be, forexample, a leadframe or a part of a leadframe, such as a die pad, or ametallic clip or any other rigid substrate. The carrier or a part of itmay be bent, for example in an S-shaped manner. This may allow thecarrier to connect two surfaces having different heights.

The devices described below include external contact elements, which maybe of any shape and size. The external contact elements may beaccessible from outside the device and may thus allow electrical contactto be made with the semiconductor chips from outside the device.Furthermore, the external contact elements may be thermally conductiveand may serve as heat sinks for dissipating the heat generated by thesemiconductor chips. The external contact elements may be composed ofany desired electrically conductive material, for example of a metal,such as copper, aluminum or gold, a metal alloy or an electricallyconductive organic material. The external contact elements may be leadsof a leadframe.

The devices may include a mold material covering at least parts of thecomponents of the devices. The mold material may be any appropriatethermoplastic or thermosetting material. Various techniques may beemployed to cover the components with the mold material, for examplecompression molding, injection molding, powder molding or liquidmolding.

FIG. 1 schematically illustrates a device 100 including a semiconductorchip 10 having a control electrode 11 and a first load electrode 12located on a first surface 13 and a second load electrode 14 located ona second surface 15 opposite to the first surface 13. Since FIG. 1illustrates a top view of the device 100, the second load electrode 14and the second surface 15 of the semiconductor chip 10 are not visible.Further, the device 100 includes a first lead 16 electrically coupled tothe control electrode 11, a second lead 17 electrically coupled to thefirst load electrode 12, a third lead 18 electrically coupled to thefirst load electrode 12, and a fourth lead 19 electrically coupled tothe second load electrode 14. The second lead 17 is separate from thethird lead 18. Thus, the second and third leads 17 and 18 areindividual, discrete leads and are not formed integrally. Moreover, atleast one the second and third leads 17 and 18 is arranged between thefirst and fourth leads 16 and 19. The other one of the second and thirdleads 17 and 18 may also be arranged between the first and fourth leads16 and 19 as illustrated in FIG. 1, but may be arranged somewhere else.

FIG. 2 schematically illustrates a device 200 including componentssimilar or identical to the components of the device 100. Thereforesimilar or identical components of the devices 100 and 200 are denotedby the same reference numerals. In the device 200, one or more firstwires 20 are used to electrically couple the second lead 17 to the firstload electrode 12, and one or more second wires 21 are used toelectrically couple the third lead 18 to the first load electrode 12.The thickness d₂₀ of the first wires is smaller than the thickness d₂₁of the second wires 21. In FIG. 2 the second and third leads 17 and 18are arranged between the first and fourth leads 16 and 19. In oneembodiment, it is possible that one of the second and third leads 17 and18 is not arranged between the first and fourth leads 16 and 19, but atanother location.

FIG. 3 schematically illustrates a device 300. Again, components similaror identical to the components of the device 100 are denoted by the samereference numerals. The device 300 includes a carrier 22, on which thesemiconductor chip 10 is mounted with its second surface 15 facing thecarrier 22. Furthermore, at least a part 23 of the second lead 17 isarranged between the first lead 16 and the carrier 22. Although thethird lead 18 is arranged between the first and fourth leads 16 and 19in FIG. 3, the third lead 18 may be arranged at another location.Moreover, the fourth lead 19 is contiguous with the carrier 22. Insteadof being made in one piece, the carrier 22 and the fourth lead 19 mayalso be separate.

FIG. 4 schematically illustrates a device 400 including componentssimilar or identical to the components of the device 100 and thusdenoted by the same reference numerals. The device 400 further includesa voltage measuring unit 24 electrically coupled to the second lead 17.In FIG. 4 the second and third leads 17 and 18 are arranged between thefirst and fourth leads 16 and 19. In one embodiment, it is possible thatone of the second and third leads 17 and 18 is not arranged between thefirst and fourth leads 16 and 19, but at another location.

FIGS. 5A to 5F schematically illustrate a method for production of adevice 500, which is illustrated in FIG. 5F. The device 500 is animplementation of the devices 100 to 300 illustrated in FIGS. 1 to 3.The features of the device 500 that are described below can therefore belikewise applied to the devices 100 to 300.

As illustrated in FIG. 5A, a leadframe 30 is provided. The leadframe 30may include a plurality of carriers 22, two of them are illustrated inFIG. 5A. A mounting hole 31 may be provided on each of the carriers 22to be used for mounting the devices 500 on a circuit board. Furthermore,four leads 16 to 19 are assigned to each of the carriers 22. The leads16 to 19 may protrude essentially in parallel from one side of thecarrier 22. The first to third leads 16 to 18 may be located on one sideof the fourth lead 19, for example on the left side of the fourth lead19 as illustrated in FIG. 5A. Each of the leads 16 to 19 may have a wirepad on the end thereof. The distance between the fourth lead 19 and thethird lead 18 adjacent to the fourth lead 19 may be greater than thedistances between the leads 16 to 18, respectively. For example, thedistance between the third and fourth leads 18 and 19 may be in therange from 1.5 to 2.5 mm. The distances between the leads 16 to 18 maybe in the range from 0.2 to 0.8 mm, respectively. The fourth lead 19 maybe contiguous with one side of the carrier 22. Furthermore, the secondlead 17 adjacent to the first lead 16 may be structured such that thepart 23 of the second lead 17 is placed between the first lead 16 andthe carrier 22. For example, the second lead 17 and in one embodimentthe third lead 18 may be L-shaped. The carriers 22 and the leads 16 to19 may be linked by dams (tie bars) 32. For reasons of clarity, only twoof the dams 32 are illustrated in FIG. 5A.

The leadframe 30 may be manufactured from metals or metal alloys, in oneembodiment copper, copper alloys, iron nickel, aluminum, aluminumalloys, or other electrically conductive materials. Furthermore, theleadframe 30 may be plated with an electrically conductive material, forexample copper, silver, iron nickel or nickel phosphorus. The shape ofthe leadframe 30 is not limited to any size or geometric shape. Theleadframe 30 may have been manufactured by punching a metal plate.

As illustrated in FIG. 5B, two semiconductor chips 10 are placed overthe carriers 22. Further semiconductor chips 10 may also be placed overfurther carriers 22 of the leadframe 30 (not illustrated in FIG. 5B).The semiconductor chips 10 may have been fabricated on a wafer made ofsemiconductor material. The semiconductor chips 10 may have beenmanufactured on the same wafer, but may have been manufactured ondifferent wafers. Furthermore, the semiconductor chips 10 may bephysically identical, but may also contain different integratedcircuits.

The semiconductor chips 10 may be mounted onto the carriers 22 withtheir second surfaces 15 facing the carriers 22. The semiconductor chips10 may be configured as power semiconductor chips, for example powerMOSFETs, IGBTs, JFETs or power bipolar transistors. In the case of apower MOSFET or a JFET, the control electrode 11 is a gate electrode,the first load electrode 12 is a source electrode and the second loadelectrode 14 is a drain electrode. In the case of an IGBT, the controlelectrode 11 is a gate electrode, the first load electrode 12 is anemitter electrode and the second load electrode 14 is a collectorelectrode. In the case of a power bipolar transistor, the controlelectrode 11 is a base electrode, the first load electrode 12 is anemitter electrode and the second load electrode 14 is a collectorelectrode.

FIG. 5C illustrates the semiconductor chip 10 mounted on the carrier 22in cross section along the line A-A′ depicted in FIG. 5B. The secondload electrode 14 may be electrically coupled to the carrier 22 bydiffusion soldering. For that, a solder material may be deposited on thesecond load electrode 14 or the upper surface of the carrier 22 (notillustrated), for example by sputtering or other appropriate physical orchemical deposition methods. The solder material may have a thickness inthe range from 100 nm to 10 μm, in one embodiment in the range from 1 to3 μm. During the soldering operation, the solder material diffuses intothe adjacent materials which leads to an intermetallic phase at theinterface between the semiconductor chip 10 and the carrier 22. Thesolder material may, for example, consist of AuSn, AgSn, CuSn, Sn, AuIn,AgIn, AuSi or CuIn.

For producing the soldered joint, the leadframe 30 may be heated by ahot plate to a temperature above the melting point of the soldermaterial, for example in the range from 200 to 400° C., in oneembodiment in the range from 330 to 350° C. In one embodiment, both theleadframe 30 and the semiconductor chips 10 may be placed in an oven andheated to an appropriate temperature. A pick-and-place tool may be usedcapable of picking the semiconductor chips 10 and placing them on theheated carriers 22. During the soldering process the semiconductor chips10 may be pressed onto the carriers 22 for an appropriate time in therange from 10 to 200 ms, in one embodiment around 50 ms.

Instead of a diffusion soldering process, other connection techniquesmay be used to attach the semiconductor chips 10 to the carriers 22, forexample soft soldering or adhesive bonding by using an electricallyconductive adhesive. When using a soft soldering process to join thesemiconductor chips 10 and the carriers 22 to each other, soldermaterial remains at the interfaces between the semiconductor chips 10and the carriers 22 after the soldering process has been finished. Incase of adhesive bonding, an electrically conductive adhesive may beused, which may be based on filled or unfilled polyimides, epoxy resins,acrylate resins, silicone resins or mixtures thereof and may be enrichedwith gold, silver, nickel or copper in order to produce electricalconductivity.

As illustrated in FIG. 5C, the fourth lead 19, which is contiguous whichthe carrier 22, may be bent in S-shape to form a step.

After the attachment of the semiconductor chips 10 to the carriers 22,electrical interconnections may be established from the controlelectrodes 11 and the first load electrodes 12 situated on the firstsurfaces 13 of the semiconductor chips 10 to the leads 16 to 18 (seeFIG. 5D). These interconnections may be made by wire bonding. Forexample, ball bonding or wedge bonding may be used as the interconnecttechnique. The bond wires may be made up of gold, aluminum, copper orany other appropriate electrically conductive material. One or more bondwires 33 may be attached to electrically couple the control electrode 11to the first lead 16. One or more bond wires 34 may be attached toelectrically couple the first load electrode 12 to the second lead 17,and one or more bond wires 35 may be attached to electrically couple thefirst load electrode 12 to the third lead 18.

It may be provided that the thickness (diameter) of the bond wires 33and/or 34 is smaller than the thickness (diameter) of the bond wires 35.For example, the thickness of the bond wires 33 and/or 34 may be in therange from 10 to 110 μm and in one embodiment smaller than 100 μm. Thethickness of the bond wires 35 may be in the range from 110 to 500 μmand in one embodiment greater than 120 μm.

As alternatives to wire bonding, other interconnect techniques may beused. For example, metallic clips may be placed on the semiconductorchips 10 and the leads 16 to 18 in order to establish the electricalconnections described above.

A mold transfer process may be carried out to encapsulate the componentsarranged on the leadframe 30 with a mold material 36 (see FIG. 5E). Themold material 36 may encapsulate any portion of the device 500, butleaves at least parts of the leads 16 to 19 uncovered. The exposed partsof the leads 16 to 19 may be used as external contact elements toelectrically couple the device 500 to other components, for example acircuit board, such as a PCB (Printed Circuit Board). Furthermore, partsof the carriers 22, for example their backsides and/or the mountingholes 31, may be left uncovered by the mold material 36. On the exposedsurfaces of the device 500 a heat sink or cooling element may beattached in order to dissipate the heat generated by the semiconductorchip 10 during operation.

The mold material 36 may be composed of any appropriate electricallyinsulating thermoplastic or thermosetting material, in one embodiment itmay be composed of a material commonly used in contemporarysemiconductor packaging technology. Various techniques may be employedto cover the components of the device 500 with the mold material 36, forexample compression molding, injection molding, powder molding or liquidmolding.

Before or after the encapsulation with the mold material 36, theindividual devices 500 are separated from one another by separation ofthe leadframe 30, for example by sawing the dams 32 (see FIG. 5F).

During operation of the device 500, the second lead 17 may be used tomeasure the electrical potential at the first load electrode 12 versus areference potential, for example ground potential. For that purpose, avoltage measuring unit may be coupled to the second lead 17 (notillustrated in FIG. 5F). The voltage measuring unit may be designed suchthat only a small current or no current flows through the bond wire 34and the second lead 17. The larger the current flowing through the bondwire 34 and the second lead 17, the larger the voltage drop caused bythis current which would detract from correctly sensing the voltage atthe first load electrode 12. For example, the internal resistance of thevoltage measuring unit may be chosen such that only a small current orno current flows through the bond wire 34 and the second lead 17. Thedrain-source current may flow through the bond wires 35 and the thirdlead 18.

Due to the arrangement of the leads 16 to 19, the gate-drain capacitanceis reduced (in case the semiconductor chip 10 is a power MOSFET). Onereason is the large distance between the first lead 16, which is coupledto the gate electrode 11, and the fourth lead 19, which is coupled tothe drain electrode 14. This also implies that the distance between thegate and drain pads arranged on the circuit board may be large thusfurther reducing the gate-drain capacitance. Another reason is that thesecond and third leads 17 and 18 (or at least one of the leads 17 and18) shield the first lead 16 from the fourth lead 19. Furthermore, thepart 23 of the second lead 17, which is arranged between the first lead16 and the carrier 22, may also help to reduce the gate-draincapacitance because the carrier 22 is also at drain potential. A highgate-drain capacitance may lead to unwanted effects, for exampleunwanted oscillating behavior of the device 500.

The voltage applied between the first and second load electrodes 12 and14 may be up to 1000 V. The switching frequency applied to the controlelectrode 11 may be in the range from 100 kHz to 1 MHz, but may also beoutside this range.

It is obvious to a person skilled in the art that the devices 100, 200,300 and 500 illustrated in FIGS. 1, 2, 3 and 5F are only intended to beexemplary embodiments, and many variations are possible. For example,the arrangement of the leads 16 to 19 may be varied as illustratedschematically in FIGS. 6 to 8. For reasons of clarity, the mold material36 is not illustrated in FIGS. 6 to 8.

In the device 600 illustrated in FIG. 6, the positions of the second andthird leads 17 and 18 are exchanged when compared to the device 500illustrated in FIG. 5D. The third lead 18, which is used to transfer thecurrent to or from the first load electrode 12, is arranged adjacent tothe first lead 16, which is coupled to the control electrode 11. Thesecond lead 17, which is used to measure the electrical potential at thefirst load electrode 12, is arranged between the third lead 18 and thefourth lead 19. In the device 600, the third lead 18 is L-shaped toshield the first lead 16 from the carrier 22.

Another variation of the device 500 is illustrated in FIG. 7. In thedevice 700 illustrated there the third lead 18 is not arranged betweenthe first and fourth leads 16 and 19. To the contrary, the first andsecond leads 16 and 17 are arranged between the third and fourth leads18 and 19. Although the bond wires 33 and 35 are crossing in FIG. 7,they are not connected.

A variation of the device 700 is the device 800 illustrated in FIG. 8.There, the first and third leads 16 and 18 are arranged between thesecond and fourth lead 17 and 19. The second lead 17 is used to measurethe potential at the first load electrode 12, and the third lead 18 isused to transfer the current to or from the first load electrode 12. Inthe device 800, the third lead 18 is L-shaped to shield the first lead16 from the carrier 22. Although the bond wires 33 and 34 are crossingin FIG. 8, they are not connected.

FIG. 9 schematically illustrates a device 900 which is an implementationof the device 400 illustrated in FIG. 4. The features of the device 900that are described below can therefore be likewise applied to the device400.

The device 900 includes a circuit board 40, for example a PCB (PrintedCircuit Board). The device 500 is mounted on the circuit board 40.Solder deposits may have been used to solder the leads 16 to 19 tocontact pads of the circuit board 40 (not illustrated). Furthermore, asemiconductor chip 41 is mounted on the circuit board 40. Thesemiconductor chip 41 includes the voltage measuring unit 24. Anelectrical connection 42 is used to electrical couple the second lead 17to the voltage measuring unit 24 included in the semiconductor chip 41.The voltage measuring unit 24 may have an internal resistance that ishigh enough so that only a small current or no current flows through thebond wire 34, the second lead 17 and the electrical connection 42. Thismay allow the voltage measuring unit 24 to measure the electrodepotential at the first load electrode 12 accurately. The load currentmay flow through the third and fourth leads 18 and 19. Instead of thedevice 500, the devices 600 to 800 may be implemented in the device 900.The electrical potential measured at the first load electrode 12 may beused for various purposes, for example for controlling the controlelectrode 11.

In addition, while a particular feature or aspect of an embodiment ofthe invention may have been disclosed with respect to only one ofseveral implementations, such feature or aspect may be combined with oneor more other features or aspects of the other implementations as may bedesired and advantageous for any given or particular application.Furthermore, to the extent that the terms “include”, “have”, “with”, orother variants thereof are used in either the detailed description orthe claims, such terms are intended to be inclusive in a manner similarto the term “comprise”. The terms “coupled” and “connected”, along withderivatives may have been used. It should be understood that these termsmay have been used to indicate that two elements co-operate or interactwith each other regardless whether they are in direct physical orelectrical contact, or they are not in direct contact with each other.Furthermore, it should be understood that embodiments of the inventionmay be implemented in discrete circuits, partially integrated circuitsor fully integrated circuits or programming means. Also, the term“exemplary” is merely meant as an example, rather than the best oroptimal. It is also to be appreciated that features and/or elementsdepicted herein are illustrated with particular dimensions relative toone another for purposes of simplicity and ease of understanding, andthat actual dimensions may differ substantially from that illustratedherein.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

1. A device comprising: a semiconductor chip having a control electrodeand a first load electrode on a first surface and a second loadelectrode on a second surface opposite to the first surface; a firstlead electrically coupled to the control electrode; a second leadelectrically coupled to the first load electrode; a third leadelectrically coupled to the first load electrode, the third lead beingseparate from the second lead; and a fourth lead electrically coupled tothe second load electrode, at least one of the second and third leadsbeing arranged between the first and fourth leads.
 2. The device ofclaim 1, comprising wherein the first, second, third and fourth leadsprotrude from one side of the device.
 3. The device of claim 1,comprising wherein the semiconductor chip is placed over a carrier withits second surface facing the carrier.
 4. The device of claim 3,comprising wherein the fourth lead is contiguous with the carrier. 5.The device of claim 3, comprising wherein at least a part of the secondlead is arranged between the first lead and the carrier.
 6. The deviceof claim 1, comprising wherein at least one first wire electricallycouples the second lead to the first load electrode.
 7. The device ofclaim 6, comprising wherein the thickness of the at least one first wireis smaller than 100 μm.
 8. The device of claim 1, comprising wherein atleast one second wire electrically couples the third lead to the firstload electrode.
 9. The device of claim 8, comprising wherein thethickness of the at least one second wire is greater than 120 μm. 10.The device of claim 8, comprising wherein the thickness of the at leastone first wire is smaller than the thickness of the at least one secondwire.
 11. The device of claim 1, comprising wherein the semiconductorchip is a power semiconductor chip.
 12. The device of claim 1,comprising wherein the semiconductor chip is a power MOSFET or an IGBT.13. The device of claim 1, comprising wherein a voltage measuring unitis electrically coupled to the second lead.
 14. The device of claim 1,comprising wherein the distance between the fourth lead and the leadadjacent to the fourth lead is greater than the distances between thefirst, second and third leads.
 15. The device of claim 1, comprisingwherein the semiconductor chip is covered by a mold material and atleast parts of the first, second, third and fourth leads are uncoveredby the mold material.
 16. A device comprising: a semiconductor chiphaving a control electrode and a first load electrode on a first surfaceand a second load electrode on a second surface opposite to the firstsurface; a first lead electrically coupled to the control electrode; asecond lead electrically coupled to the first load electrode by at leastone first wire; a third lead electrically coupled to the first loadelectrode by at least one second wire, the thickness of the at least onefirst wire being smaller than the thickness of the at least one secondwire; and a fourth lead electrically coupled to the second loadelectrode, at least one of the second and third leads being arrangedbetween the first and fourth leads.
 17. The device of claim 16,comprising wherein the thickness of the at least one first wire issmaller than 100 μm.
 18. The device of claim 16, comprising wherein thethickness of the at least one second wire is greater than 120 μm. 19.The device of claim 16, comprising wherein the at least one first wireis exactly one first wire.
 20. A device comprising: a carrier; asemiconductor chip having a control electrode and a first load electrodeon a first surface and a second load electrode on a second surfaceopposite to the first surface, the semiconductor chip being placed overthe carrier with its second surface facing the carrier; a first leadelectrically coupled to the control electrode; a second leadelectrically coupled to the first load electrode, at least a part of thesecond lead being arranged between the first lead and the carrier; athird lead electrically coupled to the first load electrode; and afourth lead electrically coupled to the carrier, the second lead beingarranged between the first lead and the fourth lead.
 21. The device ofclaim 20, comprising wherein the third lead is arranged between thesecond lead and the fourth lead.
 22. The device of claim 20, comprisingwherein at least a part of the second lead is L-shaped.
 23. A devicecomprising: a first semiconductor chip having a control electrode and afirst load electrode on a first surface and a second load electrode on asecond surface opposite to the first surface; a first lead electricallycoupled to the control electrode; a second lead electrically coupled tothe first load electrode; a third lead electrically coupled to the firstload electrode; a fourth lead electrically coupled to the second loadelectrode, at least one of the second and third leads being arrangedbetween the first and fourth leads; and a voltage measuring unitelectrically coupled to the second lead.
 24. The device of claim 23,comprising wherein the voltage measuring unit is integrated into asecond semiconductor chip.
 25. The device of claim 23, comprisingwherein the first and second semiconductor chips are placed over acircuit board.